Automated rework station provides precise placement for devices ranging from BGA / CSP / QFN to large sockets. Advanced SMT rework is accomplished using a combination of IR radiation and hot-gas convection heating.
Cost effective, easy to use manual BGA rework station for all types of SMD components. Compact unit for soldering, placement, residual solder removal (site dressing) and dispensing - using controllable profiles.
Modular dispense unit easily integrates onto production equipment & lines. Automated system precisely dispenses lines and dots on varying height surfaces, using solder paste, epoxy and underfill.
Fast and easy, stand-alone mini oven for BGA, CSP and array reballing or QFN solder bumping (paste printing). This highly effective IR unit offers multi-program modes and an inert gas option.