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MINI-OVEN: BGA REBALL


 

The Mini-Oven for Reballing handles a diverse range of BGAs, QFNs and CSPs. The unit offers programmable modes and nitrogen process gas supply. Processes can be completed in as little as 3 minutes.

Extensive selection of interchangeable frames and adjustable masks / stencils. Customized projects are welcomed.  Whether it's a small I/O device, to one with hundreds or thousands of spheres, the Mini Oven for Reball handles the task.

Rapid Technology profiles heat at the highest advisable ramp rates within a safe temperature zone.