A P P L I C A T I O N V I D E O S
SMT Rework using the Expert 4.6
Basic alignment and reflow of BGA, CSP, QFP, PLCC components
Auto Vision Alignment for Rework
Expert 10.6 camera driven alignment is fast, easy and accurate
Residual Solder Removal
Remove old solder (site cleaning) on BGAs, CSPs and other area array packages
QFN Bumping using Dotliner 06
Dispensing solder paste for QFN Pre-bumping
Dispensing on a Curved Surface
Height sensor for varying heights and slopes
Dispensing Lines and Circles
Precise underfill and line dispense applications
P R O D U C T V I D E O S
Rework System - Automated: Expert 10.6
• Convection / IR
• Large area format 19 x 24”
• Vision assisted alignment
• Contactless solder removal
Rework System - Manual: Expert 4.6
• Economy meets performance
• Move up from manual/hand rework
• xBox/gaming consoles configuration
Mini-Oven: QFN Solder Bumping
• Complete QFN solder bumping process
• Masks remains on QFN after printing paste and during flow
• Inert gas available
Mini-Oven: BGA Reball
• Stand alone unit doesn’t tie up other equipment
• Fast & easy to use with programmable modes
• Inert gas available
Precise micro dispensing of dots and lines
• Solder paste, epoxy, underfill
• Highest consistency, even for the smallest dots